Techno Horizon TI-X700i
High-precision inline automatic X-ray inspection system for the quality control of flip-chip assemblies and semiconductors, ensuring fast, reliable and reproducible defect detection during production.
This product is available from Milexia France
The TI-X700i from Techno Horizon is an X-ray inspection system designed for the quality control of flip-chip assemblies and high-density semiconductors.
It enables precise analysis of soldering conditions using laminography and optimisation of manufacturing processes through fast, reliable and fully automated inspection.
It enables the automatic inspection of all semiconductor package substrates, helping to improve quality and productivity.
Key features
- Fully automated inspection for in-line integration and reduced manual operations
- High-speed imaging with sub-micron accuracy
- Large inspection area of up to 350 × 350 mm
- Maintenance-free sealed X-ray tube, reducing operating costs
- 6.9-megapixel X-ray detector
- Resolution up to 1 µm for detailed structural analysis
- Fast inspection with an imaging time of approximately 10 seconds
- Automatic defect detection
- Designed for demanding industrial environments