Advanced solutions for wafer metrology and inspection.
For over thirty years, Milexia has become a key partner for industry players, particularly for companies involved in wafer production.
We provide fully automated, state-of-the-art equipment, supported by dedicated customer service. This approach ensures maximum equipment uptime and optimised productivity.
To meet increasing demands in terms of precision, reliability, and yield, we offer solutions covering all needs in inspection, analysis, and material and structure characterisation.
Our equipment enables:
Our partners, mainly Japanese, are leaders in their respective fields and provide innovative and high-performance solutions:
Beyond equipment supply, Milexia supports its customers at every stage of their projects:
Our goal is to ensure optimal integration of equipment into production lines while maximising availability and performance.
WaferLine is a fully automated ultrasonic wafer inspection system, delivering reliable and repeatable defect detection across the entire inspection process.
The Rigaku ONYX 3200 is the most advanced hybrid metrology solution on the market, combining second-generation micro-XRF (μXRF) and optical inspection technologies within a dual-head architecture.
The TXRF 310FAB is optimised for automatically detecting very low levels of surface metal contamination on 300 mm wafers.
The TXRF-V310 is a high-throughput TXRF spectrometer with integrated VPD, delivering ultra-sensitive, automated metal contamination analysis across the entire wafer surface.
The Rigaku XTRAIA MF-3000 (formerly MFM310) performs high-precision measurements not possible by optical or ultrasonic techniques.
The XTRAIA XD-3300 The XTRAIA XD-3300 is a versatile X-ray metrology tool that enables non-destructive analysis of single-layer and multi-layer films on 300 mm and 200 mm wafers, both smooth and structured, with high throughput for high-volume production.
A fast, hi-resolution automatic X-ray inspection system using laminography for the quality control of electronic components and semiconductors.
High-precision inline automatic X-ray inspection system for the quality control of flip-chip assemblies and semiconductors, ensuring fast, reliable and reproducible defect detection during production.
High definition CT X-ray Inspection System, designed for non-destructive testing of the most advanced electronic and semiconductor components. With an exceptional resolution of up to 0.16 µm, it enables detailed analysis of internal structures in both 2D and 3D.
You can get in touch to have a no-obligation, free consultation with an experienced Milexia sales engineer. You can discuss your project with us and get advice on the best approach.
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