Techno Horizon TI-X500s
A fast, hi-resolution automatic X-ray inspection system using laminography for the quality control of electronic components and semiconductors
The TI-X500s from Techno Horizon is an X-ray inspection system using laminography designed for demanding production environments, particularly in SMT and semiconductor manufacturing.
The TI-X500s is an X-ray inspection system that combines high-definition 3D CT imaging, vertical and oblique imaging, and automated defect analysis (C4 bumps, BGAs, LTH filling).
Thanks to a high-speed detector and optimised mechanics, it performs CT scans in under 8 seconds – three times faster than conventional systems.
Its resolution of up to 0.33 µm ensures accurate detection of the finest defects, whilst its tiltable detector (0 to 60°) enables comprehensive inspection with a simplified, easy-to-maintain design.
The TI-X500S and TI-X500i combine automated inspection, advanced defect analysis and high-speed 3D CT imaging to ensure optimal quality of electronic assemblies.
The TI-X500i model is specifically designed for in-line integration, enabling continuous automated inspection.
Key features
- High-precision automated 2D/3D inspection with excellent repeatability and reproducibility
- High-speed 3D CT imaging with an acquisition time of less than 8 seconds
- Ultra-fine resolution of up to 0.33 µm
- Advanced defect detection: C4 bumps, BGAs and LTH solder fill
- Optimised image quality thanks to a high-sensitivity 3-megapixel sensor
- Reinforced mechanical structure ensuring stability and analysis accuracy
- Inline version (TI-X500i) with conveyor for automated PCB inspection
- Simplified maintenance thanks to an optimised architecture with a single detector