Rigaku TXRF V310
The TXRF-V310 is a high-throughput TXRF spectrometer with integrated VPD, delivering ultra-sensitive, automated metal contamination analysis across the entire wafer surface.
The TXRF-V310 is an advanced total reflection X-ray fluorescence (TXRF) spectrometer with integrated Vapor Phase Decomposition (VPD), designed for high-sensitivity metal contamination analysis across all semiconductor manufacturing processes, including cleaning, lithography, etching, and deposition. It enables the detection of elements from Na to U using a single-target, three-beam X-ray system.
The integrated VPD function allows simultaneous wafer preparation and measurement, ensuring maximum throughput and minimizing operator variability.
The system is fully compatible with factory automation and features a liquid nitrogen-free detector, an in-vacuum robotic wafer handling system, and a patented XYθ stage for high precision and repeatability.
VPD-TXRF improves sensitivity by up to two orders of magnitude compared to standard TXRF and allows recovery from specific wafer areas, including the bevel.
Optional features include contamination mapping (Sweeping TXRF) for hotspot identification, ZEE-TXRF for full wafer edge measurement with zero exclusion, and BAC-TXRF for fully automated frontside and backside analysis of 300 mm wafers with non-contact handling.
TXRF-V310 Features
- Accepts 300 mm, 200 mm, and 150 mm wafers
- Wide range of analytical elements (Na~U)
- Light-element sensitivity (for Na, Mg, and Al)
- Single target 3-beam method and XYθ stage are unique to Rigaku, enabling highly accurate ultra trace analysis over the entire wafer surface. Integrated, fully-automated VPD preparation for highest sensitivity
- 1E7 atoms/cm² detection limits
- Import measurement coordinates from defect inspection tools for follow-up analysis
- Multitasking: simultaneous VPD and TXRF operation for highest throughput