Rigaku ONYX 3200
The Rigaku ONYX 3200 is an automated system for high-sensitivity metal contamination detection using grazing incidence technology.
The ONYX 3200 is the most advanced hybrid metrology solution on the market, combining second-generation micro-XRF (μXRF) and optical inspection technologies within a dual-head architecture. This unique configuration enables highly accurate defect detection while delivering exceptional throughput, making it ideal for in-line semiconductor manufacturing environments.
Designed for maximum performance and efficiency, the ONYX 3200 provides precise material characterization alongside high-resolution optical inspection, allowing users to detect, identify, and analyze defects in a single integrated platform.
The ONYX series supports a comprehensive, holistic metrology approach across the entire semiconductor manufacturing flow, from FEOL (Front-End-Of-Line) to WLP (Wafer-Level Packaging). It is particularly optimized for advanced packaging applications, including single bump analysis.
The system delivers proven performance in monitoring critical material compositions, such as the Ag/Sn ratio, and is capable of accurately measuring and identifying individual solder micro-bumps smaller than 5 µm in diameter.
By combining multiple analytical techniques into one platform, the ONYX 3200 reduces inspection time, increases process control, and enhances yield in advanced semiconductor production.
Optimized source capability
- Single μ-bump measurements for process monitoring
- High yield and improved throughput
- Accurate analysis for metal thickness and composition
- Maximum sensitivity for layer thickness and composition
ONYX 3200 Features
- Dual-head μXRF configuration offers analytical flexibility for optimal application performance
- Monochromatic and polychromatic μXRF optics
- Low-power X-ray; non-destructive
- Focused vertical excitation configuration
- Array of four silicon drift detectors (SDD) with a large active area and improved resolution.
- Composition analysis and thickness and measurements
- Fully automated calibration processes ensure long-term stability, consistency, and tube aging correction
- Advanced motion platform for sub-micron accuracy
- Ideal for in-line HVM metrology