3D Plus – COMBO

The 3DCO0849 is a space grade Configuration Memory Boot manager COMBO  to boot SRAM based FPGAs and MPSoCs requiring a large configuration memory.

3D Plus’s COMBO module provides a unique solution that combines all required hardware resources into a single module to boot  SRAM based FPGAs with the smallest PCB footprint available in the market.

Module Configuration

• Power Supply: 1.2V, 2.5V, 3.3V
• Temperature Range: -40°C to +105°C
• High level of miniaturization : 32 x 32 mm² area, 22 g

Radiation Performances

• TID > 50 krad (Si)
• SEL LET > 62.5 MeV.cm²/mg

Supporting different SRAM FPGA types

• AMD Xilinx Versal ACAP,
• AMD Xilinx Ultrascale / Ultrascale+,
• AMD Xilinx  7 Series, 6 Series, 5 Series,
• NanoXplore NG-ULTRA, ULTRA 300.