Rigaku TXRF V310
The TXRF-V310 is a high-throughput TXRF spectrometer with integrated VPD, delivering ultra-sensitive, automated metal contamination analysis across the entire wafer surface.
The TXRF-V310 is a high-throughput TXRF spectrometer with integrated VPD, delivering ultra-sensitive, automated metal contamination analysis across the entire wafer surface.
World’s first benchtop nanotomography system (nano-CT) designed to provide non-destructive three-dimensional reconstruction of the internal microstructure of objects with exceptional spatial resolution of 300nm
Benchtop X-ray microscope for non-destructive three-dimensional reconstruction of the internal microstructure of objects with micron spatial resolution.
Benchtop X-ray microtomograph (micro-CT) for non-destructive three-dimensional reconstruction of the internal microstructure of objects with a spatial resolution of 8µm
Large-chamber X-ray laboratory instrument (micro-CT) for non-destructive three-dimensional reconstruction of the internal microstructure of objects with a spatial resolution of 5µm
Automatic metal contaminant detection system using grazing incidence
Automatic thin film composition and crystallinity detection system
High definition CT X-ray Inspection System, designed for non-destructive testing of the most advanced electronic and semiconductor components. With an exceptional resolution of up to 0.16 µm, it enables detailed analysis of internal structures in both 2D and 3D.
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