Rigaku XTRAIA MF-3000

The XTRAIA MF-3000 is designed for high-volume 200 mm and 300 mm semiconductor manufacturing, delivering high-throughput thickness measurements using both XRR and XRF. It features low-contamination wafer handling and pattern recognition-based positioning, ensuring precise and reliable measurements on product wafers in production environments.

Fully compliant with cleanroom and factory automation standards (CE, S2/S8, GEM300/HSMS), the system combines high reliability with low power consumption and an optimized cost of ownership, making it well suited for in-line HVM metrology.

The system also integrates Rigaku’s proprietary COLORS X-ray optics, specifically developed for the XTRAIA MF-3000. These beam modules combine various XRF excitation sources with advanced optics to deliver high brightness on small spot sizes, enabling accurate measurements on small features and complex thin film structures. Backed by Rigaku’s in-house X-ray optics expertise, the platform is designed to meet both current and future semiconductor metrology requirements.