Integrated hybrids and 3D multi-chip modules
PDC designs highly integrated hybrids and 3D multi-chip modules containing state of the art analog, digital and mixed signal ASICs utilizing the latest packaging technologies such as:
This level of integration enables highly compact solutions that our customers can count on for the duration of their programs. PDC custom products are delivered to the most stringent quality assurance requirements.
DC 64, 128, and 256 Gb high density NAND flash features a x16 wide bus. This NAND flash uses Single-Level Cell (SLC) NAND technology. Storing 1 bit of data per memory cell, SLC NAND offers fast read and write capabilities and boot times, excellent endurance and reliability. PDC patented RAD-PAK packaging technology incorporates radiation shielding […]
3.3V ABT Octal Bus Transceiver
Controls, protects, and continuously monitors up to 150A to 12 independent electrical system loads.