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Custom Hybrids & ASICS

Integrated hybrids and 3D multi-chip modules

Este producto está disponible en Milexia Iberica

PDC designs highly integrated hybrids and 3D multi-chip modules containing state of the art analog, digital and mixed signal ASICs utilizing the latest packaging technologies such as:

  • Flip Chip
  • Ball Grid Array
  • Stacked Die
  • Embedded Magnetics

This level of integration enables highly compact solutions that our customers can count on for the duration of their programs. PDC custom products are delivered to the most stringent quality assurance requirements.

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